STMicroelectronics Secures $1.5 Billion via Dual-Tranche Convertible Bonds for Refinancing

ST said the convertible bonds’ terms allow conversion rights to be satisfied via “a combination of cash and Shares, or cash or Shares only,” and it noted that conversion would be eligible, unless the company elects otherwise, “by way of net share settlement.”
The 2033 tranche is described as paying a fixed annual coupon of 0.625%, and both tranches were set with specific initial conversion prices—$119.98 (2031) and $121.92 (2033)—representing premiums of 55% and 57.5%, respectively, over the placement VWAP.
ST previously indicated its data-center/AI infrastructure chip business could reach about $1 billion in 2026, up from an earlier forecast of more than $500 million.
The company cited near-term dilution reduction in part because ST’s share price was “above the $45.10 conversion price on the $750 million” of 2027 zero-coupon convertible notes.
STMicroelectronics has priced a $1.5 billion dual-tranche convertible bond offering, split evenly into two $750 million notes maturing in 2031 and 2033, according to TipRanks. The deal comes after ST shares have surged nearly 200% this year, giving the chipmaker a rare window to raise cheap, long-dated debt.
ST will use part of the proceeds to redeem $750 million in existing bonds due in 2027 — bonds that were already deep "in the money" at their $45.10 conversion price. That early buyback removes a near-term risk of heavy share dilution, TradingView reported.
The 2031 tranche pays zero interest. The 2033 tranche pays a fixed annual coupon of just 0.625%. Investors can convert the notes into ST shares, but only at steep premiums to recent trading prices. The 2031 conversion price is set at $119.98 — a 55% premium. The 2033 price is $121.92, a 57.5% premium, according to TipRanks.
ST structured the conversion so it can be settled "by a combination of cash and shares, or cash or shares only." The default method is net share settlement unless ST decides otherwise. In plain terms, ST has wide flexibility in how it handles any future conversion requests, limiting surprise dilution for existing shareholders.
ST shares have climbed roughly 200% so far this year, according to Yahoo Finance. That rally is largely tied to ST's pivot toward AI infrastructure chips and silicon photonics — optical components used in data-center networks. In March 2026, ST entered high-volume production of its PIC100 silicon photonics platform for AI data centers.
On June 2, ST nearly doubled its 2026 data-center revenue target to about $1 billion, up from an earlier forecast of "nicely above $500 million." CEO Jean-Marc Chery has said the infrastructure business could hit $2 billion by 2027 if current demand holds. A February deal with Amazon Web Services helped cement ST's shift away from automotive and industrial chips.
BNP Paribas and JPMorgan acted as joint global coordinators and bookrunners for the offering, according to TradingView. ST priced the bonds on June 16, with settlement targeted for June 23. Holders of the existing 2027 bonds have until July 1 to exercise their conversion rights at the old $45.10 strike price. Any remaining 2027 bonds will be redeemed for cash on July 16.
Analysts reacted with mixed views. Bank of America upgraded ST to "Buy," citing underestimated earnings power in the optical interconnect market. Deutsche Bank analyst Johannes Schaller raised his price target to €75 from €52, keeping a Buy rating. ST shares dipped 2% to 5% after the announcement — a common move when convertible bonds are issued, as traders hedge by shorting the stock.
Not everyone is bullish. Some cautious analysts forecast as much as a 57% downside from current levels, arguing the AI-driven stock re-rating has outrun actual cash flows. The bear case is simple: if hyperscalers like AWS slow their data-center spending, ST could be left with heavy costs and thin margins. The new bonds push ST's debt wall out to 2031 and 2033, buying time — but the AI bet still has to pay off.
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