NVIDIA and Lorentz Collaborate

Lorentz and NVIDIA Present Automated 3D EM Extraction at TSMC OIP

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Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP

owensoundsuntimes.com

Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP

leaderpost.com

Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP

mitchelladvocate.com

Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP

Lorentz and NVIDIA Present Automated 3D EM Extraction at TSMC OIP

recorder.ca

Lorentz Solution, Inc., the world’s leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced packaging, is partnering with NVIDIA at the TSMC 2026 Open Innovation Platform (OIP) Ecosystem Forum in Santa Clara, CA. PeakView’�s automated xLEM™ flow extends Lorentz’S 3D EM leadership from design to full-chip EM sign-off, delivering complete LVS-clean electromagnetic verification for ultra-high-speed AI, photonics and IC/3DIC designs. This is the third consecutive year that LorentZ and NVIDIA will present cutting-edge EM technologies for real silicon designs at the OIP.

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NVIDIA and Lorentz Collaborate

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