Quobly raises €115 million Series A to bring affordable quantum computing to market by 2026.

French quantum startup Quobly has raised about €115 million (reported as €115m or roughly €130m) to scale up its silicon-based quantum computing from lab validation to industrial production, with a first commercial system planned for the end of 2026. The Series A is led by Bpifrance, STMicroelectronics, and Sealsq, with additional participation including the European Innovation Council and other investors, and it aims to accelerate R&D, industrialization, and international commercialization. Quobly’s approach uses silicon spin qubits built around quantum dots, encoding information in electron spin while seeking to improve coordination and readout reliability by isolating quantum dots from interfering reservoirs and simplifying qubit layouts into smaller arrays. It also targets affordability by leveraging semiconductor manufacturing infrastructure and economies of scale, positioning its machines as potentially far cheaper than competing quantum technologies. The funding comes amid broader government pushes for quantum research in Europe and the US, including France’s promised €1 billion commitment and the current U.S. administration’s $2 billion plan under President Donald Trump.
Quobly said its silicon spin-qubit design tackles specific technical bottlenecks, including “capacitive coupling,” where neighboring quantum dots exchange energy and reduce calculation accuracy, and interference from the electron “reservoir.”
On readout, Quobly noted that spin-qubit machines typically require “charge sensors,” which can have limited sensitivity (missing some output data) and are relatively large—constraints it says its approach helps overcome.
Quobly’s CEO Maud Vinet tied the cost target to semiconductor-scale manufacturing, saying it can build quantum computers “100 times cheaper than competing technologies,” and emphasized the need for chipmaker-grade yield and repeatable fabrication results.
The company detailed deployment timing and interfaces: its first system, “Alloy Pioneer,” will be accessible “through the cloud in 2026,” followed by deployment inside HPC infrastructures in 2027, and it will be integrated with existing data-center requirements via a compatible footprint/power/utility profile.
The financing announcement also named additional investors and backers: participation from the EIC Fund plus Blast, ALIAD (Air Liquide Venture Capital), and existing investor Innovacom, with shareholders including CEA, CNRS, Quantonation, and Supernova Invest.
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